{"id":8470,"date":"2026-05-22T17:30:13","date_gmt":"2026-05-22T14:30:13","guid":{"rendered":"https:\/\/avies.com\/urunler\/modular-artificial-intelligence-computer\/"},"modified":"2026-05-22T17:30:13","modified_gmt":"2026-05-22T14:30:13","slug":"modular-artificial-intelligence-computer","status":"publish","type":"urunler","link":"https:\/\/avies.com\/en\/product\/modular-artificial-intelligence-computer\/","title":{"rendered":"Modular Artificial Intelligence Computer"},"content":{"rendered":"
<\/div>
MAIC-100<\/span><\/div>

Modular Artificial Intelligence Computer<\/span><\/h2>

Rugged Design<\/strong>
\nModularity & Scalability<\/strong>
\nHigh End AI Processing Power<\/strong><\/p>\n<\/div><\/div>

<\/div>

AV\u0130ES Modular Artificial Intelligence Computer is a rugged, modular, scalable computing and interface unit for avionics, military, industrial and robotics applications.<\/p>\n<\/div><\/div><\/div><\/div>

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MAIC-100 is a scalable AI computing unit specifically designed to fulfil wide-ranging requirements of avionics, military and robotics applications. It has a module-based design such that various type of functional modules exists for different tasks and IO operations. Each module has its own sealed DSUB connectors to provide external IO interface. Modules connect to each other via pass through board to board connectors. MAIC-100 is capable to achieve complex AI tasks based on its powerful processor.<\/p>\n

The smallest functional MAIC-100 unit consists of two modules which are Base Module and Processing Module. In case of necessity, up to 5 functional modules can be attached between these two essential modules without the need for a main board. This unique design ensures flexibility, customizability and ability to fast prototyping for MAIC-100 architecture.<\/p>\n<\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/section>

Technical Specifications<\/h4>\n<\/div><\/div>
<\/div>
\n\n\n\n\n\n\n\n
NVIDIA JETSON based Processing Power up to 248 TOPS<\/td>\n<\/tr>\n
84W Power Output Capable Base Board<\/td>\n<\/tr>\n
Processing Module IOs; GB ETH, USB 2.0, UART, CAN, GPIO<\/td>\n<\/tr>\n
Module Dimension 22 x 170 x 140 mm<\/td>\n<\/tr>\n
Weight < 2 kg (3 Module version)<\/td>\n<\/tr>\n
Weight < 3.5 kg (7 Module version)<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n<\/div><\/div>
<\/div>

MAIC-100 Module List<\/h4>\n<\/div><\/div>
<\/div>
    \n
  • Processing Module<\/li>\n
  • Base Module<\/li>\n
  • Storage Module (Up to 8 TB)<\/li>\n
  • Removable Memory Module<\/li>\n
  • Video Module<\/li>\n
  • MIL-STD-1553 Module<\/li>\n
  • ARINC429 Module<\/li>\n
  • Deterministic Network Module<\/li>\n
  • RF Communication Module<\/li>\n
  • Audio Module<\/li>\n
  • Analog IO Module<\/li>\n
  • Discrete IO Module<\/li>\n
  • GPS Module<\/li>\n
  • Data Encryption Module<\/li>\n<\/ul>\n<\/div><\/div><\/div><\/div>

    Qualifications<\/h4>\n<\/div><\/div>
    <\/div>
      \n
    • MIL-STD-810<\/li>\n
    • MIL-STD-704<\/li>\n
    • MIL-STD-461<\/li>\n
    • DO-160G<\/li>\n<\/ul>\n<\/div><\/div>
      <\/div>

      Environmental Conditions<\/h4>\n<\/div><\/div>
      <\/div>
        \n
      • Operating Temperature and Altitude -40\u00b0C \/ +71\u00b0C, 50.000 ft<\/li>\n
      • Storage Temperature -55\u00b0C \/ +85\u00b0C<\/li>\n<\/ul>\n<\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/div><\/section>\n","protected":false},"featured_media":8467,"template":"","class_list":["post-8470","urunler","type-urunler","status-publish","has-post-thumbnail","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/avies.com\/en\/wp-json\/wp\/v2\/urunler\/8470","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/avies.com\/en\/wp-json\/wp\/v2\/urunler"}],"about":[{"href":"https:\/\/avies.com\/en\/wp-json\/wp\/v2\/types\/urunler"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/avies.com\/en\/wp-json\/wp\/v2\/media\/8467"}],"wp:attachment":[{"href":"https:\/\/avies.com\/en\/wp-json\/wp\/v2\/media?parent=8470"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}